Tips for Manufacturing FPC Connectors

Author：Danny / time：2019-01-02 / The number of clicks：415

With the high demand for smaller consumer electronics on the market, FPC, which plays a leading role on the market, has to improve accordingly. The SMT techniques for FPCs are different from the manufacturing of the traditional PCB. The feature of FPC connectors lies in the strict standards in the technique of processing specific points, fastening, printing, patching, back welding, inspecting, and layering.

Preprocessing of specific points: We all know that flexibility is the feature of an FPC, hence the name flexible circuit board. This kind of product usually doesn’t apply to vacuum packaging, and the moisture in the air that it may be exposed to during the delivery process may damage the quality of products. To solve this problem, the board will undergo a pre-curing procedure. Generally, the pre-curing procedure is done at 80-100 degrees Celsius, which lasts for 4 – 8 hours. In special conditions, the temperature may be set above 125 degrees Celsius to make sure the moisture in the FPC connectors is evaporated in order to prevent flaws like blistering or layering. After the pre-curing procedure is completed, the FPC connector should be free from flaws such as discoloring, deforming, or layering, only after which it can be identified as a qualified product by IPQC. 

Fastening: Fastening is an essential process in manufacturing FPC connectors. If glitches occur in the fastening process of SMT techniques, FPC boards cannot function properly, which leads to failures in the procedures of printing, patching, and sifting, causing a lag in the manufacturing process. The problem lies in the insufficient solidness and the flexibility of the FPC connectors. A common solution is to fasten the FPC connector on the positioning pinboard or non-positioning pinboard to prevent it from deviating.

Patching: The patching process is a necessary operation following the fastening of the FPC connector. There are two kinds of patching: single-sided tape fastening and double-sided tape fastening. The choice depends on factors like the properties of the product, the number of components, and the efficiency of the patches. The single-sided tape fastening method usually applies the thin and high-temperature resistant taps as a tool to fasten the FPC connector, and it’s beneficial for its high efficiency and low cost; there is no leftover, either.

 

    There are two steps of the double-sided tape fastening procedure. First, place the high-temperature resistant double-sided tape on the pinboard. Then, place the FPC connector on the board. Note that the tape is less sticky, so it’s important to keep the FPC connectors from being ripped off. This patching method can keep FPC connectors from being misplaced.

Back welding: This is an infrared reflow soldering method that applies forceful heat waves. It inspects whether there are flaws in the FPC connectors and removes flaws like empty welding, double welding, and welding beads, and any other welding problems in the technique. Note the temperature curve in the reflow soldering process. Due to the FPC connector’s lack of temperature uniformity, proper manipulation of temperature is necessary.

   Testing, inspecting, and layering: Compared with the previous procedures, which focus on the production of FPC connectors, the final stage of testing, inspecting, and layering is to guarantee the appropriateness and completion of the products. This step is very important, since the quality control may influence the reputation of the company.

The above-mentioned points are the major tips for manufacturing FPC connector. There is a tremendous scientific theoretical basis behind these simple steps. Corporations should take caution in dealing with each step.